Assembly, mechanical processing, bending and punching, lacquer and heat treatment processes design in Minsk
Parts processing technical process design
- Development of control programs for CNC machines, machining centers, with development and implementation at the customer's production
- Development of a technological process for machining parts with its development and implementation at the customer's production
- Development of a technological process of lacquer coatings with the development and implementation of it at the customer's production
- Development of a technological process of punching/bending with its development and implementation at the customer's production
- Development of a welding technological process with its development and implementation at the customer's production
- Development of a technological process for heat treatment of parts of optoelectronic devices with the development and implementation of it at the customer's production
Regarding issues of service delivery, please address:
Pavel Sharapov
Phone +375173891272
e-mail: sharapov_pn@peleng.by
Assembly and wiring process design
- Optoelectronic devices assembly technological processes development, taking into account the equipment the customer has (when providing a list of equipment, or with the visit of a Process Engineering Service specialist)
- Optical units assembly technological process development with conversion and implementation
- Optoelectronic devices adjusting technological processes development according to the customer's ID, taking into account the equipment the customer has (when providing a list of equipment, or with the visit of a Process Engineering Service specialist)
- Development of technological processes for testing optoelectronic devices according to the customer's specifications, taking into account the equipment the customer has (when providing a list of equipment, or with the visit of a Process Engineering Service specialist)
- Checking optoelectronic devices for manufacturability in accordance with GOST 14.201-83, GOST 14.205-83. Statement on manufacturability for optoelectronic devices in accordance with GOST 14.201-83, GOST 14.205-83
- Conversion and implementation of optoelectronic devices assembly technological processes with further updating
- Carrying out control assemblies/disassembly of optoelectronic systems subunits
- Conducting field supervision of assembly/disassembly of optoelectronic devices subunits under technological processes developed by JSC "Peleng"
- Development of a technological process for wiring harnesses and cables
- Development of patterns for harnesses knitting
- Development of a technological process for wiring on printed circuit assemblies for space-wired interconnections
- Development of a data set for the manufacture of a mask for applying solder paste in the CAM 350 program (Gerber file) If necessary - ordering a mask for applying solder paste
- Development of a technological process for wiring on printed circuit assemblies for SMD-mounting using the equipment of JSC "Peleng"
- Development of a technological process for wiring on printed circuit assemblies for SMD-mounting using the customer's equipment based on the results of familiarization with it
- Development of programs for installing components using the customer's installation machine based on the results of familiarization with it.
Regarding issues of service delivery, please address:
Konstantin Rusakevich
Phone +375173891121
e-mail: rusakevich_kv@peleng.by
3D models development
- Development of parts' 3D models according to the submitted design documentation
Development time depending on complexity and volume – from 3 days.
Regarding issues of service delivery, please address:
Yuriy Dashkevich
Phone +375447465290
e-mail: otl_sgt@tut.by
